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Intellectual Property Law
: TinytechIPUS Patent 7321714 - Nanoparticle material on IC package
By blaisemouttet
This patent from ERS Company includes some very basic claims to a moisture resistant seal for integrated circuits formed from nanoparticle material. Claim 1 reads:
1. A packaged electronic device, comprising: a substrate with a first surface having an integrated circuit thereon; and a nano-particle material adjacent to the first surface.
Full post as published by TinytechIP on January 24, 2008 (boomark / email).
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