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Intellectual Property Law
: TinytechIPUS Patent 7342179 - Metallic nanoparticle bonding layer
By blaisemouttet
This patent from Seiko Epson (priority 1/14/2004) includes some basic claims to using fused nanoparticles as a bonding material. Claim 1 reads:
1. An electronic device comprising: two components; a receiving layer on at least one of the two components, the receiving layer including at least one of conductive particles and conductive fibers; and metallic nanoparticles on the receiving layer and bonding the two components together; wherein at least some of the nanoparticles are bonded together and closely contacted with the receiving layer by fusing.
Full post as published by TinytechIP on March 13, 2008 (boomark / email).
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