Intellectual Property Law

US Patent 7453154 - CNT via flip chip interconnect

This patent from Delphi Technologies teaches forming the via connections between electronic circuit substrates with carbon nanotubes. Claim 1 reads:

1. An electronic package comprising:

a first electronic device including an electronic circuit having an input/output pad, and at least one electrically conductive carbon nanotube extending from the input/output pad and beyond a surface of the device to provide an interconnect;

a second electronic device, the first electronic device mounted on the second electronic device to form a stacked arrangement;

a substrate, the stacked arrangement mounted on the substrate, the carbon nanotube extending away from the first electronic device, through an opening in the second electronic device, and connected to the substrate.

Full post as published by TinytechIP on November 24, 2008 (boomark / email).