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US Patent 7416019 - CNT thermal interface with >50% packing ratio

http://www.freepatentsonline.com/7416019.htmlThis patent from Johns Hopkins University teaches a high density multiwall carbon nanotube array forming a high efficiency thermal interface useful for integrated circuit cooling. Claim 1 reads: 1. A thermal interface comprising:a first structure for making thermal contact with a second, different structure; anda plurality of substantively aligned carbon nanotubes protruding substantively perpendicularly from a first surface of the first structure to read more

Full post as published by TinytechIP on August 26, 2008 (boomark / email).