Intellectual Property Law

US Patent 7354788 - Scanning probe memory formed by duel wafer manufacture

By blaisemouttet

Scanning probe microscopy techniques have allowed for nanoscale inspection and characterization in the past decades and have gradually been applied to spin-off applications in nano-lithography and high density memory such as IBM's use of 1,024 probe tips for a high density memory. This patent from Intel is along similar lines and teaches segmenting CMOS circuitry from the MEMS-based scanning probe structures to provide for easier fabrication. Claim 1 reads:

1. A method comprising: fabricating microelectromechanical (MEMS) structures of a Seek and Scan Probe (SSP) memory device on a first wafer; and fabricating CMOS and memory medium components of the SSP memory device on a second wafer.

Full post as published by TinytechIP on April 08, 2008 (boomark / email).